The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Apr. 11, 2017
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Rainer Kohlstrung, Plankstadt, DE;

Klaus Rappmann, Weinheim-Rittenweier, DE;

Assignee:

Henkel AG & Co. KGaA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/00 (2006.01); C08J 9/08 (2006.01); C08L 33/06 (2006.01); B29C 35/02 (2006.01); C09J 5/06 (2006.01); C09J 5/08 (2006.01); C09J 123/08 (2006.01); C08L 23/08 (2006.01); B29K 23/00 (2006.01);
U.S. Cl.
CPC ...
C08J 9/0061 (2013.01); B29C 35/02 (2013.01); C08J 9/0023 (2013.01); C08J 9/08 (2013.01); C08L 33/06 (2013.01); C09J 5/06 (2013.01); C09J 5/08 (2013.01); C09J 123/0853 (2013.01); B29K 2023/083 (2013.01); C08J 2201/024 (2013.01); C08J 2201/026 (2013.01); C08J 2203/02 (2013.01); C08J 2207/02 (2013.01); C08J 2323/08 (2013.01); C08J 2423/08 (2013.01); C08L 23/08 (2013.01); C09J 2431/00 (2013.01); C09J 2433/00 (2013.01);
Abstract

The present invention relates to a thermally expandable composition comprising at least one peroxidically crosslinking polymer which does not contain glycidyl (meth) acrylate as a monomer in copolymerized form; at least one polymer, which is polymerized with glycidyl (meth) acrylate as a monomer present in a proportion of from 2 to 20% by weight, based on the respective polymer; at least one peroxide; and at least one endothermic chemical propellant, moldings containing this composition, and a method for sealing and filling cavities in components, for reinforcing or stiffening components, in particular hollow components, and for bonding movable components using such molded bodies.


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