The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2023
Filed:
Jun. 29, 2018
Applicant:
Dow Silicones Corporation, Midland, MI (US);
Inventors:
Jingui Jiang, Shanghai, CN;
Zhihua Liu, Shanghai, CN;
Jiayin Zhu, Shanghai, CN;
Wenjie Chen, Shanghai, CN;
Shenglan Zhang, Shanghai, CN;
Assignee:
Dow Silicones Corportation, Midland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/20 (2006.01); C08G 77/12 (2006.01); C08G 77/16 (2006.01); C08G 77/18 (2006.01); C09J 183/06 (2006.01);
U.S. Cl.
CPC ...
C08G 77/20 (2013.01); C08G 77/12 (2013.01); C08G 77/16 (2013.01); C08G 77/18 (2013.01); C09J 183/06 (2013.01);
Abstract
A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.