The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2023
Filed:
Oct. 26, 2018
Applicant:
Eneos Corporation, Tokyo, JP;
Inventors:
Assignee:
ENEOS Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/26 (2006.01); C07D 265/16 (2006.01); C08G 59/24 (2006.01); C08K 3/36 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C08G 59/26 (2013.01); C07D 265/16 (2013.01); C08G 59/24 (2013.01); C08G 59/245 (2013.01); C08K 3/36 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01);
Abstract
The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a biphenyl type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).