The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Sep. 21, 2016
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Paul Andrew Chludzinski, Hampstead, NC (US);

Dominick Fiordimalva, Hickory, NC (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03B 37/012 (2006.01); C03B 37/027 (2006.01);
U.S. Cl.
CPC ...
C03B 37/01222 (2013.01); C03B 37/01211 (2013.01); C03B 37/01248 (2013.01); C03B 37/027 (2013.01); C03B 2201/02 (2013.01); C03B 2201/06 (2013.01); C03B 2201/31 (2013.01); C03B 2203/22 (2013.01); C03B 2203/224 (2013.01); C03B 2203/225 (2013.01); C03B 2203/23 (2013.01); C03B 2203/34 (2013.01); Y02P 40/57 (2015.11);
Abstract

The present disclosure provides optical fiber preforms formed from core canes having large core-clad ratio, intermediate core-cladding assemblies, and methods for making the preforms and core cladding assemblies. The preforms are made with capped core canes. The capping material has a coefficient of thermal expansion less than the coefficient of thermal expansion of the core cane and more closely matched to or lower than the coefficient of thermal expansion of the surrounding cladding monolith in a cane-in-soot process. Presence of the cap reduces stresses that arise from differential thermal expansion of the core cane and cladding materials and leads to preforms having low defect concentration and low probability of failure during subsequent thermal processing steps.


Find Patent Forward Citations

Loading…