IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11577500 B1

PDFFull Text
Date of Patent:
Feb. 14, 2023

Filed:

Dec. 11, 2020

Heat bonding of low energy surface substrates

Applicant:

Zephyros, Inc., Romeo, MI (US);

Inventors:

Kenneth A. Mazich, Birmingham, MI (US);

Jeffrey R. Apfel, Shelby Township, MI (US);

Kenneth S. Makuch, Swartz Creek, MI (US);

Assignee:

ZEPHYROS, INC., Romeo, MI (US);

Attorney:

The Dobrusin Law Firm, P.C.

Primary Examiner:

Philip C Tucker

Assistant Examiner:

Nickolas R Harm

Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 37/12 (2006.01); B32B 27/32 (2006.01); B32B 5/02 (2006.01); B32B 5/20 (2006.01); B32B 7/12 (2006.01); B32B 27/06 (2006.01); B32B 27/08 (2006.01); B32B 27/12 (2006.01); B32B 27/38 (2006.01); B32B 27/26 (2006.01); B32B 5/24 (2006.01); C09J 5/06 (2006.01); B32B 27/16 (2006.01); B32B 37/14 (2006.01); C09J 1/00 (2006.01); B32B 38/00 (2006.01); B29C 65/04 (2006.01); B29C 65/32 (2006.01); B29C 65/46 (2006.01); B29C 65/48 (2006.01); B29C 65/14 (2006.01);
U.S. Cl.
CPC ...
B32B 37/12 (2013.01); B32B 5/024 (2013.01); B32B 5/20 (2013.01); B32B 5/245 (2013.01); B32B 7/12 (2013.01); B32B 27/065 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/16 (2013.01); B32B 27/26 (2013.01); B32B 27/32 (2013.01); B32B 27/38 (2013.01); B32B 37/14 (2013.01); C09J 1/00 (2013.01); C09J 5/06 (2013.01); B29C 65/04 (2013.01); B29C 65/1403 (2013.01); B29C 65/32 (2013.01); B29C 65/46 (2013.01); B29C 65/489 (2013.01); B29C 65/4815 (2013.01); B29C 65/4835 (2013.01); B32B 2038/0084 (2013.01); B32B 2262/02 (2013.01); B32B 2264/105 (2013.01); B32B 2307/30 (2013.01); B32B 2307/546 (2013.01); B32B 2307/558 (2013.01); B32B 2309/02 (2013.01); B32B 2310/0812 (2013.01); B32B 2310/0868 (2013.01); B32B 2311/30 (2013.01); B32B 2605/003 (2013.01); B32B 2607/00 (2013.01); C09J 2301/416 (2020.08); C09J 2423/04 (2013.01); C09J 2423/10 (2013.01);
Abstract

A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.

Find Patent Forward Citations

Loading…