The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Dec. 27, 2018
Applicant:

Lotte Chemical Corporation., Seoul, KR;

Inventors:

Sang Hwa Lee, Uiwang-si, KR;

Yeong Deuk Seo, Uiwang-si, KR;

Sang Hyun Hong, Uiwang-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/34 (2006.01); C08L 77/06 (2006.01); C08K 9/04 (2006.01); C08K 3/26 (2006.01);
U.S. Cl.
CPC ...
B32B 27/34 (2013.01); C08K 9/04 (2013.01); C08L 77/06 (2013.01); B32B 2307/308 (2013.01); C08K 2003/265 (2013.01); Y10T 428/31725 (2015.04);
Abstract

A polyamide resin composition and a molded article manufactured using the same. The polyamide resin composition includes: about 40 wt % to about 60 wt % of a polyamide resin including a repeat unit represented by Formula 1 and a repeat unit represented by Formula 2 as defined in the specification; about 1 wt % to about 10 wt % of a maleic anhydride-modified olefin-based copolymer; about 5 wt % to about 20 wt % of calcium carbonate subjected to surface treatment with a silane compound; and about 20 wt % to about 40 wt % of glass fibers, wherein the silane compound includes a functional group comprising an amino group, an epoxy group, and/or a (meth)acryloxy group. The polyamide resin composition and the molded article produced using the same can have good properties in terms of plating adhesion, impact resistance, thermal resistance, and/or appearance, and the like.


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