The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2023
Filed:
Mar. 15, 2018
Hewlett-packard Development Company, L.p., Spring, TX (US);
Kristopher J. Erickson, Palo Alto, CA (US);
Paul Olubummo, Palo Alto, CA (US);
Aja Hartman, Palo Alto, CA (US);
Lihua Zhao, Palo Alto, CA (US);
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Abstract
A three-dimensional printing system can include polymeric build material and jettable fluid(s). The polymeric build material can have an average particle size from 20 μm to 150 μm, a first melt viscosity, and a melting temperature from 75° C. to 350° C. In one example, the jettable fluid can include water, from 0.1 wt % to 10 wt % of electromagnetic radiation absorber, and from 10 wt % to 35 wt % of an organic solvent plasticizer. Contacting a first portion of a layer of the polymeric build material with the jettable fluid can provide an organic solvent plasticizer loading from 2 wt % to 10 wt % based on the polymeric build material content. The first melt viscosity of the polymeric build material at the first portion can be reduced and the melting temperature of the polymeric build material at the first portion can be decreased by 3° C. to 15° C.