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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11576307 B1

PDFFull Text
Date of Patent:
Feb. 14, 2023

Filed:

Jan. 07, 2020

Bundling system for high capacity baler

Applicant:

Great Plains Manufacturing, Inc., Salina, KS (US);

Inventors:

Brian Olander, Salina, KS (US);

Taylor Bozarth, Lindsborg, KS (US);

Assignee:

Great Plains Manufacturing, Inc., Salina, KS (US);

Attorneys:

Hovey Williams LLP

Kameron D. Kelly

Primary Examiner:

Jimmy T Nguyen

Int. Cl.
CPC ...
A01F 15/14 (2006.01); A01F 15/04 (2006.01); A01F 15/08 (2006.01); A01F 15/10 (2006.01); A01F 15/16 (2006.01); B60K 35/00 (2006.01); G01B 5/02 (2006.01); A01D 89/00 (2006.01); A01F 15/02 (2006.01); A01D 85/00 (2006.01); B30B 9/30 (2006.01);
U.S. Cl.
CPC ...
A01F 15/046 (2013.01); A01D 85/005 (2013.01); A01D 89/002 (2013.01); A01F 15/02 (2013.01); A01F 15/04 (2013.01); A01F 15/044 (2013.01); A01F 15/08 (2013.01); A01F 15/0825 (2013.01); A01F 15/0841 (2013.01); A01F 15/0875 (2013.01); A01F 15/10 (2013.01); A01F 15/101 (2013.01); A01F 15/14 (2013.01); A01F 15/145 (2013.01); A01F 15/16 (2013.01); B30B 9/3014 (2013.01); B60K 35/00 (2013.01); G01B 5/02 (2013.01); A01D 2085/007 (2013.01); A01D 2085/008 (2013.01); A01F 15/042 (2013.01); A01F 2015/102 (2013.01); B30B 9/3092 (2013.01);
Abstract

A baling system including a first bale-forming area configured to form a first series of first individual bales, and a second bale forming-area configured to from a second series of second individual bales. The baling system further includes a bale bundler configured to receive the first and second individual bales from the first and second bale forming-forming areas and to tie a group of at least six bales together to form a bale bundle.

Find Patent Forward Citations

Olander, Brian. (2023). Bundling system for high capacity baler (U.S. Patent No. 11576307). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11576307

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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