The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2023
Filed:
Oct. 18, 2018
Applicant:
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Inventor:
Yoshinori Matsuura, Ageo, JP;
Assignee:
MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/09 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4658 (2013.01); H05K 1/09 (2013.01); H05K 3/062 (2013.01); H05K 3/067 (2013.01); H05K 2203/0353 (2013.01); H05K 2203/0384 (2013.01);
Abstract
An extremely thin copper foil is provided that enables formation of highly fine different wiring patterns with a line/space (L/S) of 10 μm or less/10 μm or less on two sides of the copper foil and is thus usable as an inexpensive and readily processable substitution for silicon and glass interposers. The extremely thin copper foil includes, in sequence, a first extremely thin copper layer, an etching stopper layer, and the second extremely thin copper layer. Two sides of the extremely thin copper foil each have an arithmetic average roughness Ra of 20 nm or less.