The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2023
Filed:
Mar. 09, 2021
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Joo Hwan Jung, Suwon-si, KR;
Jae Woong Choi, Suwon-si, KR;
Seung Eun Lee, Suwon-si, KR;
Yong Hoon Kim, Suwon-si, KR;
Jin Won Lee, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); H05K 1/0313 (2013.01); H05K 1/115 (2013.01); H05K 1/142 (2013.01); H05K 1/181 (2013.01); H05K 1/0243 (2013.01); H05K 2201/09518 (2013.01);
Abstract
A connection structure embedded substrate includes a printed circuit board including a first insulating body and a plurality of first wiring layers disposed on at least one of an external region or an internal region of the first insulating body; and a connection structure embedded in the first insulating body and including first and second substrates. The first and second substrates are disposed adjacent to each other.