The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2023
Filed:
Nov. 06, 2018
Photonis France, Brive, FR;
Stéphane Personne, Noailles, FR;
PHOTONIS FRANCE, Brive, FR;
Abstract
A method of making leak tight electrical connections through the wall of a ceramic package, for example a ceramic package used on an image intensifier tube. The method comprises a hole metallisation step () to obtain vias, the metallisation step comprising the deposition of a bond layer (), a diffusion barrier () acting as a metallic base layer and a wetting agent (). For each via, a filler metal preform made of indium or a eutectic chosen from among InSn, AuSn, AuGe, AgSn is deposited () on each orifice and is heated to a temperature higher than its melting temperature () such that the molten filler metal closes off the via to make it leak tight.