The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

Apr. 23, 2019
Applicants:

Tsinghua University, Beijing, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Yuan-Feng Liu, Beijing, CN;

Ze-Cheng Hou, Beijing, CN;

Lu Chen, Beijing, CN;

Lin Zhu, Beijing, CN;

Wen-Zhen Li, Beijing, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/1393 (2010.01); H01M 10/0525 (2010.01); H01M 4/1395 (2010.01); H01M 4/134 (2010.01); H01M 4/133 (2010.01);
U.S. Cl.
CPC ...
H01M 4/1393 (2013.01); H01M 4/133 (2013.01); H01M 4/134 (2013.01); H01M 4/1395 (2013.01); H01M 10/0525 (2013.01);
Abstract

A method for forming a current collector is provided. At least two carbon nanostructure reinforced copper composite substrates are provided. The at least two carbon nanostructure reinforced copper composite substrates are stacked to form a composite substrate. An active metal layer is disposed on a surface of the composite substrate to form a first a composite structure. The first composite structure is pressed to form a second composite structure. The second composite structure is annealed to form a third composite structure. The third composite structure is de-alloyed to form a porous copper composite.


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