The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2023
Filed:
Dec. 21, 2018
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Hiroyasu Matsugai, Kanagawa, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
The present disclosure relates to a camera package, a manufacturing method of a camera package, and an electronic device capable of reducing a manufacturing cost for forming a lens. The manufacturing method of the camera package according to the present disclosure includes forming a high-contact angle film around a lens forming region on an upper side of a transparent substrate that protects a solid-state imaging element, dropping a lens material in the lens forming region on the upper side of the transparent substrate, and molding the dropped lens material by a mold to form a lens. The present disclosure is applicable to, for example, a camera package and the like in which a lens is arranged above a solid-state imaging element.