The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

Feb. 28, 2020
Applicant:

Macom Technology Solutions Holdings, Inc., Lowell, MA (US);

Inventors:

James Joseph Brogle, Merrimac, MA (US);

Joseph Gerard Bukowski, Derry, NH (US);

Margaret Mary Barter, Lowell, MA (US);

Timothy Edward Boles, Tyngsboro, MA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/06 (2006.01); H01L 21/822 (2006.01); H03K 17/74 (2006.01); H01L 29/205 (2006.01); H01L 29/00 (2006.01); H01L 31/075 (2012.01);
U.S. Cl.
CPC ...
H01L 27/0676 (2013.01); H01L 21/822 (2013.01); H01L 29/00 (2013.01); H01L 29/205 (2013.01); H01L 31/075 (2013.01); H03K 17/74 (2013.01);
Abstract

A number of monolithic multi-throw diode switch structures are described. The monolithic multi-throw diode switches can include a hybrid arrangement of diodes with different intrinsic regions, all formed over the same semiconductor substrate. In one example, two PIN diodes in a monolithic multi-throw diode switch have different intrinsic region thicknesses. The first PIN diode has a thinner intrinsic region, and the second PIN diode has a thicker intrinsic region. This configuration allows for both the thin intrinsic region PIN diode and the thick intrinsic region PIN diode to be individually optimized. As one example, for a switch functioning in a dedicated transmit/receive mode, the first transmit PIN diode can have a thicker intrinsic region than the second receive PIN diode to maximize power handling for the transmit arm and maximize receive sensitivity and insertion loss in the receive arm.


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