The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2023
Filed:
Nov. 29, 2018
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventor:
Ryo Fujita, Hyogo, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); B23K 3/03 (2006.01); B23K 35/26 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 37/00 (2006.01); B23K 3/08 (2006.01); B23K 1/008 (2006.01); B23K 3/04 (2006.01); B23K 1/19 (2006.01); B23K 103/00 (2006.01); B23K 103/12 (2006.01); H01L 33/48 (2010.01); B23K 101/36 (2006.01); B23K 101/42 (2006.01); B23K 103/18 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 1/20 (2013.01); B23K 3/0338 (2013.01); B23K 3/04 (2013.01); B23K 3/08 (2013.01); B23K 3/087 (2013.01); B23K 35/262 (2013.01); B23K 37/003 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); B23K 2101/36 (2018.08); B23K 2101/42 (2018.08); B23K 2103/12 (2018.08); B23K 2103/18 (2018.08); B23K 2103/56 (2018.08); H01L 33/486 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/75253 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15747 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract
A component joining apparatus, which can realize positioning between a component and a substrate with high accuracy by avoiding influence of thermal expansion of the substrate at the time of joining the component to the substrate by heating at a high temperature, includes a component supply head holding a component and a heating stage heating and holding a substrate, in which a heating region where the heating stage contacts the substrate includes a joining region of the substrate in which the component is joined, and the substrate is larger than the heating stage and a peripheral part of the substrate does not contact the heating stage.