The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

May. 05, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Takahito Watanabe, Yokohama, JP;

Risa Miyazawa, Isehara, JP;

Hiroyuki Mori, Yasu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/532 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); H01L 23/5329 (2013.01); H01L 23/5383 (2013.01); H01L 23/53228 (2013.01);
Abstract

Aspects of the present disclosure relate to a method for fabricating an interconnection layer carrying structure. A carrier is provided. An organic layer is deposited on the carrier, wherein the organic layer includes a multi-layer wiring structure therein, and the uppermost surface is covered with an organic top layer. A sacrificial layer is deposited on the organic top layer. The carrier and the organic layer are diced together with the sacrificial layer.


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