The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

Jul. 09, 2021
Applicant:

Schneider Electric Industries Sas, Rueil-Malmaison, FR;

Inventors:

Weihe Fei, Shanghai, CN;

Zhaocai Wang, Shenzhen, CN;

Assignee:

Schneider Electric Industries SAS, Rueil-Malmaison, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133311 (2021.01); B32B 37/12 (2013.01); G02F 1/133331 (2021.01); B32B 2037/1253 (2013.01); B32B 2307/7265 (2013.01); B32B 2457/202 (2013.01); G02F 2202/28 (2013.01);
Abstract

The present disclosure relates to a module structure of a liquid crystal display, the module structure includes a panel glass assembly, a backlight assembly and a display housing retaining wall; an accommodating space formed by the display housing retaining wall accommodates the panel glass assembly and the backlight assembly; the panel glass assembly includes a front glass sheet, a rear glass sheet and a sealant for sealing a liquid crystal accommodating space between the front glass sheet and the rear glass sheet. The module structure is characterized in that, a filling gap is provided between outer peripheral surfaces of the front glass sheet and the rear glass sheet of the panel glass assembly and an inner peripheral surface of the display housing retaining wall facing the outer peripheral surfaces; and a panel edge protective adhesive is filled in the filling gap. The present disclosure also relates to a manufacturing process of the module structure.


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