The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

Apr. 21, 2021
Applicant:

Vitesco Technologies Usa, Llc, Auburn Hills, MI (US);

Inventors:

Jen-Huang Albert Chiou, Libertyville, IL (US);

Shiuh-Hui Steven Chen, Lake Zurich, IL (US);

Assignee:

VITESCO TECHNOLOGIES USA, LLC, Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); B81B 7/02 (2006.01); G01L 19/14 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0055 (2013.01); B81B 7/02 (2013.01); G01L 9/0042 (2013.01); G01L 19/148 (2013.01); B81B 2201/0264 (2013.01);
Abstract

A pressure sensing element, including a substrate, a device layer coupled to the substrate, a diaphragm being part of the device layer, and a plurality of piezoresistors coupled to the diaphragm. A plurality of bond pads is disposed on the device layer, and an electrical field shield is bonded to the top of device layer and at least one of the bond pads. At least one stress adjustor is part of the electrical field shield, where the stress adjustor is a cut-out constructed and arranged to reduce thermal hysteresis of the pressure sensing element caused by stress relaxation of the electrical field shield during a cooling and heating cycle. The stress adjustor may be a thin film deposited on top of the electrical field shield, which may apply residual stress to the piezoresistors. The pressure sensing element may include a cavity integrally formed as part of the substrate.


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