The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2023
Filed:
Nov. 03, 2016
Applicant:
Endress + Hauser SE + Co. KG, Maulburg, DE;
Inventors:
Assignee:
ENDRESS + HAUSER SE+CO. KG, Maulburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 23/284 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 23/66 (2006.01); H01P 3/16 (2006.01); H01P 7/10 (2006.01); H01P 11/00 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
G01F 23/284 (2013.01); H01L 21/4825 (2013.01); H01L 23/4952 (2013.01); H01L 23/66 (2013.01); H01P 3/16 (2013.01); H01P 7/10 (2013.01); H01P 11/008 (2013.01); H01Q 1/225 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01);
Abstract
A radar based, fill-level sensor comprising at least one semiconductor element, including at least a semiconductor chip and a chip package, in which the at least one semiconductor chip is arranged, wherein the at least one semiconductor chip has at least one coupling element, which serves as a signal gate for electromagnetic waves, preferably in the millimeter wave region, characterized in that at least one first resonator structure is arranged on a surface portion of the chip package.