The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2023
Filed:
Nov. 30, 2018
Korea Institute of Machinery & Materials, Daejeon, KR;
KOREA INSTITUTE OF MATERIALS SCIENCE, Changwon-si, KR;
Abstract
A high-entropy alloy having ultra-high strength and high hydrogen embrittlement resistance due to formation of a microstructure at a low strain may be produced without a severe plastic deformation. A method for producing the high-entropy alloy includes (a) annealing and homogenizing an initial alloy material at 1000 to 1200° C. for 1 to 24 hours; and (b) rolling the annealed and homogenized initial alloy material into a rod, at a cryogenic temperature of −100 to −200° C. while pressing the initial alloy material in multi-axial directions at a strain of 0.4 to 1.2, thereby to produce the high-entropy alloy having intersecting twins as a microstructure, and secondary fine twins formed in the intersecting twins, wherein the initial alloy material contains Co of 5 to 35%, Cr of 5 to 35%, Fe of 5 to 35%, Mn of 5 to 35%, and Ni of 5 to 35%, based on weight %.