The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

Jan. 29, 2020
Applicant:

Savare′ I.c. S.r.l., Milan, IT;

Inventors:

Italo Corzani, Chieti, IT;

Biagio Savare′, Milan, IT;

Assignee:

Savare' I.C. S.r.l., Milan, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 123/22 (2006.01); A61L 15/24 (2006.01); A61L 15/60 (2006.01); B32B 7/12 (2006.01); A61F 13/49 (2006.01); A61F 13/539 (2006.01); A61F 13/02 (2006.01); A61F 13/47 (2006.01); C08K 5/01 (2006.01);
U.S. Cl.
CPC ...
C09J 123/22 (2013.01); A61F 13/0253 (2013.01); A61F 13/47 (2013.01); A61F 13/49 (2013.01); A61F 13/539 (2013.01); A61L 15/24 (2013.01); A61L 15/60 (2013.01); B32B 7/12 (2013.01); A61F 2013/5395 (2013.01); C08K 5/01 (2013.01);
Abstract

Adhesive hot-melt formulations with a main polymeric component, of at least one isotactic metallocene butene-1 polymer composition, that has a low viscosity, and that has a bimodal composition, directly obtained during polymerization, in two consecutive and separate reaction steps. Moreover, said hot-melts include less than 5% by weight of at least one viscosity modifier that is not solid at room temperature. Such unusually low level of said additives, surprisingly allows to attain substantially improved levels both of high adhesiveness and cohesion. The adhesive hot-melt formulations include less than 5% by weight of a polyethylene wax or of a blend of polyethylene waxes, that characterized by a highly linear/non-branched structure and by an exceptionally low Polydispersity Index. The presence of such peculiar polyethylene waxes, that are partially incompatible with the butene-1 polymer composition, allows to use the disclosed hot-melt formulations even in the presence of fibrous or perforated substrates.


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