The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

Jun. 04, 2021
Applicant:

Elite Material Co., Ltd., Taoyuan, TW;

Inventors:

Ching-Hsien Hsu, Taoyuan, TW;

Tse-Hung Liu, Taoyuan, TW;

Tsan-Hung Tsai, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/3492 (2006.01); C08L 71/12 (2006.01);
U.S. Cl.
CPC ...
C08L 71/123 (2013.01); C08K 5/34924 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01);
Abstract

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and 20 parts by weight to 80 parts by weight of a polyolefin resin; the polyolefin resin includes styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.


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