The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2023

Filed:

Jul. 24, 2019
Applicant:

Clariant International Ltd, Muttenz, CH;

Inventors:

Jeremia Schwabe, Augsburg, DE;

Erik Hauck, Pirmasens, DE;

Simon Bodendorfer, Augsburg, DE;

Sebastijan Bach, Charlotte, NC (US);

Matthias Roessle, Reutern, DE;

Torsten Lindner, Schwalbach am Taunus, DE;

Robert Turner, Cincinnati, OH (US);

Christian Neu, Schwalbach am Taunus, DE;

Matthias Morand, Schwalbach am Taunus, DE;

Gabriele Stiehl, Schwalbach am Taunus, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/16 (2006.01); C08L 23/14 (2006.01); C09J 123/14 (2006.01);
U.S. Cl.
CPC ...
C08L 23/14 (2013.01); C08L 23/16 (2013.01); C09J 123/14 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01); C08L 2314/06 (2013.01);
Abstract

The invention relates to thermoplastic molding compounds having melt viscosities of less than 30,000 mPas for use as a hot-melt adhesive, comprising the components A and B, wherein component A comprises one or more C/Ccopolymers each produced with metallocene catalysts and each having a melt viscosity at 170° C. of less than 20,000 mPas, measured according to DIN 53019, and a molecular weight Mof 1000 g/mol to 50,000 g/mol, and component B comprises one or more C/Ccopolymers each produced with metallocene catalysts and each having a melt flow index MI of 1 to 100 g/m in, measured at 190° C./2.16 kg, according to ASTM D 1238, and a molecular weight Mof 50,000 g/mol to 300,000 g/mol. Said thermoplastic molding compounds, because of the viscosity and mechanical properties thereof, are suitable for fiber mesh applications.


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