The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Nov. 27, 2020
Applicant:

At&s (Chongqing) Company Limited, Chongqing, CN;

Inventor:

Artan Baftiri, Chongqing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); H05K 1/185 (2013.01);
Abstract

A method of manufacturing component carriers is disclosed. The method includes providing a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, forming a first hole in a core of the stack and subsequently embedding a first component in the first hole, thereafter forming a second hole in the same core of the stack and subsequently embedding a second component in the second hole. A component carrier has a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A first hole is formed in a core of the stack. A first component is embedded in the first hole. A second hole is formed in the same core of the stack and subsequently a second component is embedded in the second hole.


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