The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Feb. 22, 2018
National Institute for Materials Science, Tsukuba, JP;
Denka Company Limited, Tokyo, JP;
Seiji Kuroda, Tsukuba, JP;
Hiroshi Araki, Tsukuba, JP;
Akira Hasegawa, Tsukuba, JP;
Makoto Watanabe, Tsukuba, JP;
Atsushi Sakai, Omuta, JP;
Yoshitaka Taniguchi, Omuta, JP;
Suzuya Yamada, Tokyo, JP;
NATIONAL INSTITUTE FOR MATERIALS SCIENCE, Tsukuba, JP;
DENKA COMPANY LIMITED, Tokyo, JP;
Abstract
A method for manufacturing an aluminum circuit board including a step of spraying a heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and of forming a metal layer on a surface of the ceramic base material. A temperature of at least a part of the metal powder is higher than or equal to a softening temperature of the metal powder and lower than or equal to a melting point of the metal powder at a time point of reaching the surface of the ceramic base material. A velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.