The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Nov. 05, 2018
Applicant:
Fuji Corporation, Chiryu, JP;
Inventor:
Kenji Tsukada, Toyota, JP;
Assignee:
FUJI CORPORATION, Chiryu, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/14 (2006.01); H05K 3/02 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 3/022 (2013.01); H05K 1/097 (2013.01); H05K 3/14 (2013.01); H05K 2201/02 (2013.01); H05K 2203/0104 (2013.01); H05K 2203/0756 (2013.01);
Abstract
A circuit forming method, comprising: a coating step of applying a metal-containing liquid and a metal paste in an overlapping manner on a base, the metal-containing liquid containing fine metal particles and the metal paste containing a resin binder and metal particles larger than the fine metal particles in the metal-containing liquid; and a heating step of making the metal-containing liquid and the metal paste coated in the coating step conductive by heating the metal-containing liquid and the metal paste.