The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Apr. 08, 2021
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Han-Min Cho, Gyeonggi-do, KR;

Chan-Gi Park, Gyeonggi-do, KR;

Yeon-Sang Yun, Gyeonggi-do, KR;

Tae-Wook Ham, Gyeonggi-do, KR;

Hei-Seong Kwak, Gyeonggi-do, KR;

Byoung-Il Son, Gyeonggi-do, KR;

Sung-Chul Park, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01Q 1/24 (2006.01); H01Q 5/35 (2015.01); H05K 1/02 (2006.01); H01Q 21/28 (2006.01); H01Q 1/38 (2006.01); H01R 12/79 (2011.01); H01R 13/66 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/38 (2013.01); H01Q 5/35 (2015.01); H01Q 21/28 (2013.01); H01R 12/79 (2013.01); H01R 13/6691 (2013.01); H05K 1/028 (2013.01); H05K 1/0218 (2013.01); H05K 1/0243 (2013.01); H05K 1/115 (2013.01); H05K 1/142 (2013.01); H05K 1/148 (2013.01); H05K 1/18 (2013.01); H05K 7/1427 (2013.01); H05K 2201/0999 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/10098 (2013.01);
Abstract

Disclosed is an electronic device comprising a first component, a second component, and a signal path interface coupled between the first component and the second component, the signal path interface including a printed circuit board (PCB) having a rigid PCB portion and a flexible PCB portion, wherein a first signal line and a second signal line extend through the rigid PCB portion and the flexible PCB portion for transmitting signals from the first component to the second components, and a plurality of ground lines extend through the rigid PCB portion and the flexible PCB portion, and wherein each of the plurality of ground lines extending through the rigid PCB portion is connected to one or more conductive layers through conductive vias.


Find Patent Forward Citations

Loading…