The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Oct. 27, 2021
Applicant:
Ngk Insulators, Ltd., Nagoya, JP;
Inventors:
Yudai Uno, Nagoya, JP;
Tomoyoshi Tai, Inazawa, JP;
Keiichiro Asai, Nagoya, JP;
Masato Niwa, Inuyama, JP;
Assignee:
NGK INSULATORS, LTD., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/18 (2006.01); H01L 41/09 (2006.01); H01L 41/187 (2006.01); G02B 26/08 (2006.01);
U.S. Cl.
CPC ...
H01L 41/09 (2013.01); H01L 41/187 (2013.01); G02B 26/0858 (2013.01);
Abstract
A vibrating plate-bonded body includes a supporting substrate composed of silicon, a vibrating plate composed of a highly rigid ceramics and having a thickness of 100 μm or smaller, and a bonding layer between the supporting substrate and vibrating plate, contacting a bonding surface of the vibrating plate and composed of α-Si. The arithmetic average roughness Ra of the bonding surface of the vibrating plate is 0.01 nm or more and 10.0 nm or less, and the pit density of the bonding surface of the vibrating plate is 10 counts or more per 100 μm.