The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Jun. 29, 2021
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventor:

Chun-Shun Huang, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/45 (2006.01); H01L 21/28 (2006.01); H01L 21/285 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66515 (2013.01); H01L 21/28052 (2013.01); H01L 21/28518 (2013.01); H01L 29/0653 (2013.01); H01L 29/456 (2013.01); H01L 29/4933 (2013.01); H01L 29/665 (2013.01);
Abstract

The present disclosure a method for manufacturing a metal-oxide-semiconductor (MOS) transistor device. The method includes steps of providing a substrate; forming a gate electrode over the substrate; forming a source region and a drain region in the substrate; depositing an isolating layer over the substrate and the gate electrode; forming a plurality of contact holes in the isolating layer to expose the gate electrode, the source region, and the drain region; forming a plurality of metal contacts in the gate electrode, the source region, and the drain region; depositing a contact liner in the contact holes; and depositing a conductive material in the contact holes, wherein the conductive material is surrounded by the contact liner.


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