The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Mar. 09, 2021
Applicant:

Broadpak Corporation, San Jose, CA (US);

Inventor:

Farhang Yazdani, Santa Clara, CA (US);

Assignee:

BroadPak Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 23/467 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/14 (2006.01); H01L 23/04 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 21/486 (2013.01); H01L 21/52 (2013.01); H01L 23/04 (2013.01); H01L 23/13 (2013.01); H01L 23/147 (2013.01); H01L 23/3107 (2013.01); H01L 23/36 (2013.01); H01L 23/467 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 23/573 (2013.01); H01L 23/66 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 23/5383 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1052 (2013.01); H01L 2225/1082 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/30107 (2013.01); Y10T 29/53174 (2015.01); Y10T 29/53178 (2015.01); Y10T 29/53183 (2015.01);
Abstract

An integrated circuit package comprising one or more electronic component(s); and one or more substrate(s), including a first substrate and a second substrate, wherein said first substrate including a first cavity on a first surface of said first substrate and a second cavity on a second surface of said first substrate, said second substrate includes a third cavity on a first surface of said second substrate and a fourth cavity on a second surface of said second substrate, said first substrate and said second substrate are stacked and coupled, and said one or more electronic component(s) is/are disposed inside said first cavity of first substrate and said fourth cavity of second substrate.


Find Patent Forward Citations

Loading…