The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Apr. 12, 2021
Applicant:

Google Llc, Mountain View, CA (US);

Inventor:

Theodore Charles White, Santa Barbara, CA (US);

Assignee:

Google LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 25/065 (2006.01); G06N 10/00 (2022.01); H01L 27/18 (2006.01); H01L 23/48 (2006.01); H01L 23/532 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01P 7/08 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G06N 10/00 (2019.01); H01L 23/481 (2013.01); H01L 23/53228 (2013.01); H01L 23/53257 (2013.01); H01L 23/53285 (2013.01); H01L 23/66 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 25/50 (2013.01); H01L 27/18 (2013.01); H01P 7/086 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05179 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13179 (2013.01); H01L 2224/13183 (2013.01); H01L 2224/81409 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/04941 (2013.01);
Abstract

A device includes: a first chip including a qubit; and a second chip bonded to the first chip, the second chip including a substrate including first and second opposing surfaces, the first surface facing the first chip, wherein the second chip includes a single layer of superconductor material on the first surface of the substrate, the single layer of superconductor material including a first circuit element. The second chip further includes a second layer on the second surface of the substrate, the second layer including a second circuit element. The second chip further includes a through connector that extends from the first surface of the substrate to the second surface of the substrate and electrically connects a portion of the single layer of superconducting material to the second circuit element.


Find Patent Forward Citations

Loading…