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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11569195 B1

PDFFull Text
Date of Patent:
Jan. 31, 2023

Filed:

Jun. 21, 2019

Semiconductor packaging structure and method of fabricating same

Applicant:

Kore Semiconductor Co., Ltd., Qingdao, CN;

Inventors:

Ching-Yu Ni, New Taipei, TW;

Young-Way Liu, New Taipei, TW;

Assignee:

Kore Semiconductor Co., Ltd., Qingdao, CN;

Attorney:

ScienBiziP, P.C.

Primary Examiner:

Dale E Page

Assistant Examiner:

Quovaunda Jefferson

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 21/4846 (2013.01); H01L 21/563 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3107 (2013.01); H01L 23/498 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/1601 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/16502 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81815 (2013.01);
Abstract

A semiconductor packaging structure manufactured in a manner which does not leave the chip damaged or susceptible to damage upon the removal of temporary manufacturing supports includes at least one electrical conductor, at least one conductive layer, a chip, and a colloid. The chip is spaced from the conductive layer, the electrical conductor is disposed between the conductive layer and the chip and electrically connects the conductive layer to the chip. The colloid covers all outer surfaces of the chip. A method of fabricating such a semiconductor packaging structure is also provided.

Find Patent Forward Citations

Ni, Ching-Yu. (2023). Semiconductor packaging structure and method of fabricating same (U.S. Patent No. 11569195). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11569195

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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