The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Mar. 16, 2020
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Enis Tuncer, Dallas, TX (US);

John Paul Tellkamp, Rockwall, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 43/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49551 (2013.01); H01L 21/4842 (2013.01); H01L 23/49503 (2013.01); H01L 23/49562 (2013.01); H01L 43/04 (2013.01);
Abstract

A leadframe includes leads or lead terminals, a plurality of folded features including i) support features positioned within an area defined in at least one dimension by the leads or the lead terminals configured for supporting at least one of a die pad and a first pad and a second pad spaced apart from one another, or ii) current carrying features. At least one of the folded features includes a planar portion and a folded edge structure that curves upwards at an angle of at least 45° relative to the planar portion. The folded features are configured to provide an effective increase in thickness to reduce the deformation observed in assembly.


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