The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Apr. 06, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Shinichi Miwa, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/04 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 23/041 (2013.01); H01L 23/66 (2013.01); H01L 2223/6655 (2013.01);
Abstract
This semiconductor device is provided with a device substrate in which a semiconductor circuit including two high frequency amplifiers; a cap substrate and a sealing frame of a conductor which forms and air-tightly seals space surrounding an area, in which the semiconductor circuit is formed, between the device substrate and the cap substrate, wherein the sealing frame is configured as a line of a 90-degree hybrid circuit or a line of a rat-race circuit.