The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Apr. 30, 2020
Applicant:

Meta Platforms Technologies, Llc, Menlo Park, CA (US);

Inventors:

Stephan Lutgen, Dresden, DE;

Thomas Lauermann, Cork, IE;

Assignee:

Meta Platforms Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 33/62 (2010.01); H01L 33/02 (2010.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); G02B 27/01 (2006.01); H01L 33/32 (2010.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 21/2007 (2013.01); G02B 27/0172 (2013.01); H01L 27/156 (2013.01); H01L 33/0062 (2013.01); H01L 33/0066 (2013.01); H01L 33/0093 (2020.05); H01L 33/025 (2013.01); H01L 33/32 (2013.01); H01L 33/502 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); G02B 2027/0116 (2013.01); G02B 2027/0178 (2013.01); H01L 2224/4852 (2013.01);
Abstract

Disclosed herein are techniques for bonding components of LEDs. According to certain embodiments, a device includes a first component and a second component. The first component includes a semiconductor layer stack having an n-side semiconductor layer, an active light emitting layer, and a p-side semiconductor layer. The semiconductor layer stack includes a III-V semiconductor material. The second component includes a passive or an active matrix integrated circuit within a Si layer. A first dielectric material of the first component is bonded to a second dielectric material of the second component. First contacts of the first component are aligned with and bonded to second contacts of the second component. The first contacts of the first component form a first pattern within the first dielectric material of the first component, and the second contacts of the second component form a second pattern within the second dielectric material of the second component.


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