The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Dec. 15, 2016
Applicant:
The Boeing Company, Chicago, IL (US);
Inventor:
John Porter, Edgewood, WA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 13/012 (2006.01); B23K 3/06 (2006.01); H01B 13/00 (2006.01); H02G 1/12 (2006.01); H01R 43/28 (2006.01); B23K 3/08 (2006.01); H01B 13/34 (2006.01); H01B 13/06 (2006.01); H01B 13/32 (2006.01); B21F 3/00 (2006.01); B21F 3/04 (2006.01); H02G 1/08 (2006.01); G01R 31/58 (2020.01); G01R 31/59 (2020.01);
U.S. Cl.
CPC ...
H01B 13/01236 (2013.01); B23K 3/063 (2013.01); H01B 13/0003 (2013.01); H01B 13/0036 (2013.01); H02G 1/1248 (2013.01); B21F 3/00 (2013.01); B21F 3/04 (2013.01); B23K 3/087 (2013.01); G01R 31/58 (2020.01); G01R 31/59 (2020.01); H01B 13/06 (2013.01); H01B 13/32 (2013.01); H01B 13/345 (2013.01); H01R 43/28 (2013.01); H02G 1/08 (2013.01); Y10T 29/49194 (2015.01); Y10T 29/49197 (2015.01); Y10T 29/53213 (2015.01); Y10T 29/53217 (2015.01); Y10T 29/53243 (2015.01);
Abstract
In wire processing systems and methods, a wire channel receives a wire. One or more fluid guides flow the fluid into the wire channel to move, along the wire, a component (e.g. a solder sleeve) positioned at least partially in the wire channel and coupled to the wire. Other features are also provided.