The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Sep. 09, 2021
Kioxia Corporation, Tokyo, JP;
Kazushige Kawasaki, Kawasaki Kanagawa, JP;
Masayuki Miura, Ota Tokyo, JP;
Hideko Mukaida, Chuo Tokyo, JP;
KIOXIA CORPORATION, Tokyo, JP;
Abstract
A semiconductor device of an embodiment includes: a wiring board having a first surface and a second surface on a side opposite to the first surface; a first semiconductor element on the first surface of the wiring board; a second semiconductor element on the first surface of the wiring board; and a first sealing material that seals at least the second semiconductor element. A slit is formed in the first sealing material between the first semiconductor element and the second semiconductor element. When a thickness of the first sealing material on the first semiconductor element is tand a thickness of the first sealing material on the second semiconductor element is t, the tand the tsatisfy a relationship of 0≤t<t