The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

May. 07, 2021
Applicant:

Meta Platforms Technologies, Llc, Menlo Park, CA (US);

Inventors:

Xinqiao Liu, Medina, WA (US);

Barbara De Salvo, Belmont, CA (US);

Hans Reyserhove, San Jose, CA (US);

Ziyun Li, Redmond, WA (US);

Asif Imtiaz Khan, Campbell, CA (US);

Syed Shakib Sarwar, Bellevue, WA (US);

Assignee:

Meta Platforms Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 19/00 (2011.01); G06F 3/01 (2006.01); G06T 7/73 (2017.01); G02B 27/01 (2006.01); G06V 20/20 (2022.01); G06K 9/62 (2022.01); G06V 10/44 (2022.01); G06V 10/94 (2022.01); G06V 20/64 (2022.01); G06V 30/192 (2022.01); H04N 5/378 (2011.01); H01L 27/146 (2006.01); H01L 31/0352 (2006.01); H01L 31/0384 (2006.01); H01L 27/28 (2006.01); H01L 27/30 (2006.01);
U.S. Cl.
CPC ...
G06T 19/006 (2013.01); G02B 27/017 (2013.01); G02B 27/0172 (2013.01); G06F 3/013 (2013.01); G06K 9/627 (2013.01); G06K 9/6256 (2013.01); G06K 9/6268 (2013.01); G06T 7/73 (2017.01); G06V 10/454 (2022.01); G06V 10/955 (2022.01); G06V 20/20 (2022.01); G06V 20/64 (2022.01); G06V 20/647 (2022.01); G06V 30/195 (2022.01); G02B 2027/011 (2013.01); G02B 2027/014 (2013.01); G02B 2027/0138 (2013.01); G02B 2027/0178 (2013.01); G06T 2207/20084 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 27/14665 (2013.01); H01L 27/286 (2013.01); H01L 27/307 (2013.01); H01L 31/03845 (2013.01); H01L 31/035218 (2013.01); H04N 5/378 (2013.01);
Abstract

In one example, an apparatus comprises: a first sensor layer, including an array of pixel cells configured to generate pixel data; and one or more semiconductor layers located beneath the first sensor layer with the one or more semiconductor layers being electrically connected to the first sensor layer via interconnects. The one or more semiconductor layers comprises on-chip compute circuits configured to receive the pixel data via the interconnects and process the pixel data, the on-chip compute circuits comprising: a machine learning (ML) model accelerator configured to implement a convolutional neural network (CNN) model to process the pixel data; a first memory to store coefficients of the CNN model and instruction codes; a second memory to store the pixel data of a frame; and a controller configured to execute the codes to control operations of the ML model accelerator, the first memory, and the second memory.


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