The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Feb. 04, 2021
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Gaku Echigoya, Tokyo, JP;
Hiroshi Satou, Tokyo, JP;
Keijiro Ishida, Tokyo, JP;
Hajime Kudo, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01); H01F 27/02 (2006.01); H01G 2/24 (2006.01);
U.S. Cl.
CPC ...
G06K 19/06046 (2013.01); G06K 19/06037 (2013.01); H01F 27/02 (2013.01); H01G 2/24 (2013.01);
Abstract
In a multilayer chip component according to an aspect of the present disclosure, dots of a two-dimensional code provided on a main surface of an element body has a semicircular cross-sectional shape. That is, since substantially no corner portions are present in a cross-sectional shape of the dots, stress is unlikely to remain when the dots are formed, and stress is unlikely to be concentrated after the dots are formed. Therefore, cracking is unlikely to occur in the foregoing multilayer chip component.