The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Oct. 19, 2018
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Mathias Elzner, Erfurt, DE;

Thomas Ullmann, Arnstadt, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01P 1/02 (2006.01); G01D 5/14 (2006.01); G01D 11/30 (2006.01); G01P 3/487 (2006.01);
U.S. Cl.
CPC ...
G01P 1/026 (2013.01); G01D 5/145 (2013.01); G01D 11/30 (2013.01); G01P 3/487 (2013.01);
Abstract

A sensor assembly comprising a holder body and a housed semiconductor sensor element situated on the holder body for rotational speed measurement and/or position measurement, a cured enveloping material that covers the housed semiconductor sensor element completely being situated on the holder body. It is provided that the housed semiconductor sensor element is glued onto a mounting surface of the holder body using an adhesive that differs from the enveloping material, and that the adhesive is situated in a receiving space between the mounting surface and a bottom side of the housed semiconductor sensor element that is facing the mounting surface.


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