The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

May. 19, 2022
Applicant:

Lumileds Llc, San Jose, CA (US);

Inventors:

Marc Droegeler, Aachen, DE;

Thorsten Lenzen, Aachen, DE;

Matthias Holtrup, Aachen, DE;

Joseph Hendrik Anna Maria Jacobs, Aachen, DE;

Assignee:

Lumileds LLC, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); F21S 45/47 (2018.01); F21S 41/141 (2018.01); F21K 9/68 (2016.01); F21K 9/90 (2016.01); F21Y 115/10 (2016.01); F21W 107/10 (2018.01);
U.S. Cl.
CPC ...
F21S 45/47 (2018.01); F21K 9/68 (2016.08); F21K 9/90 (2013.01); F21S 41/141 (2018.01); F21W 2107/10 (2018.01); F21Y 2115/10 (2016.08);
Abstract

A heatsink, a light-emitting diode (LED) module and a corresponding method of manufacture are described. A heatsink includes an electrically conductive heatsink core and an electrically insulating layer covering at least the first surface of the electrically conductive heatsink core. The electrically conductive heatsink core has a first pin that is integral with the electrically conductive heatsink core and protrudes from a first surface of the heatsink core. At least the first surface of the heatsink core is covered by an electrically insulating layer, which leaves at least portions of a lateral surface of the first pin exposed from the electrically insulating layer.


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