The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Nov. 25, 2020
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Tetsuya Aoyama, Nagano, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D21H 23/20 (2006.01); D01G 11/00 (2006.01); D21H 17/36 (2006.01); D21C 5/02 (2006.01); D21H 17/26 (2006.01); D21H 17/28 (2006.01); D21H 11/14 (2006.01); D21H 17/37 (2006.01);
U.S. Cl.
CPC ...
D21H 23/20 (2013.01); D01G 11/00 (2013.01); D21C 5/02 (2013.01); D21H 11/14 (2013.01); D21H 17/26 (2013.01); D21H 17/28 (2013.01); D21H 17/36 (2013.01); D21H 17/375 (2013.01);
Abstract
A fiber assembly-forming method includes providing a water-soluble resin to a first feedstock containing fibers, forming disintegrated matter by disintegrating the first feedstock provided with the water-soluble resin, depositing the disintegrated matter, and providing water to the deposited disintegrated matter.