The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Oct. 31, 2018
Applicant:

Adeka Corporation, Tokyo, JP;

Inventors:

Keisuke Banno, Saitama, JP;

Naoko Tanji, Saitama, JP;

Yutaka Yonezawa, Saitama, JP;

Assignee:

ADEKA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 21/04 (2006.01); C08K 3/22 (2006.01); C08K 3/32 (2006.01); C08K 3/34 (2006.01); C08K 5/52 (2006.01); C08K 13/02 (2006.01); C08L 23/12 (2006.01); C09K 21/02 (2006.01); C09K 21/12 (2006.01);
U.S. Cl.
CPC ...
C09K 21/04 (2013.01); C08K 3/22 (2013.01); C08K 3/32 (2013.01); C08K 3/34 (2013.01); C08K 5/5205 (2013.01); C08K 13/02 (2013.01); C08L 23/12 (2013.01); C09K 21/02 (2013.01); C09K 21/12 (2013.01); C08K 2003/2296 (2013.01); C08K 2003/323 (2013.01); C08K 2003/343 (2013.01); C08K 2201/014 (2013.01); C08L 2201/02 (2013.01); C08L 2207/324 (2013.01);
Abstract

Disclosed is a composition that can impart a drip preventing effect together with an excellent heat release suppressing effect to a resin, and that enables the resin to exhibit an excellent color tone, by being mixed with the resin. The composition includes a component (A) and/or a component (B), and a component (C). It is preferable that the composition contains the component (C) in an amount of 0.1 to 50 parts by mass relative to 100 parts by mass of a total of the components (A) and (B). The component (A) is a (poly)phosphate compound represented by General Formula (1). The component (B) is a (poly)phosphate compound represented by General Formula (3). The component (C) is a hydrous magnesium silicate.


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