The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Aug. 24, 2020
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventor:

Tatsuya Yamazaki, Tomioka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); H01L 33/60 (2010.01); C09J 9/02 (2006.01); H01L 23/00 (2006.01); H01L 33/62 (2010.01); C09J 183/04 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C09J 9/02 (2013.01); C09J 183/04 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); C08L 2203/14 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0715 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15738 (2013.01);
Abstract

A thermosetting silicone resin composition contains the following components (A-1) to (D): (A-1) an alkenyl group-containing linear organopolysiloxane; (A-2) a branched organopolysiloxane shown by (RSiO)(RSiO)(SiO)(1); (B-1) a branched organohydrogenpolysiloxane shown by (HRSiO)(RSiO)(SiO)(2); (B-2) a linear organohydrogenpolysiloxane shown by (RSiO)(HRSiO)(RSiO)(3); (C) an adhesion aid which is an epoxy group-containing branched organopolysiloxane; and (D) a catalyst containing a combination of a zero-valent platinum complex with a divalent platinum complex and/or a tetravalent platinum complex. This provides a thermosetting silicone resin composition which causes little contamination at a gold pad portion and has excellent adhesiveness to a silver lead frame.


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