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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11566127 B1

PDFFull Text
Date of Patent:
Jan. 31, 2023

Filed:

Dec. 17, 2019

Resin composition and article made therefrom

Applicant:

Elite Material Co., Ltd., Taoyuan, TW;

Inventors:

Yan Zhang, Kunshan, CN;

Jue Tan, Kunshan, CN;

Rongtao Wang, Kunshan, CN;

Assignee:

Elite Material Co., Ltd., Taoyuan, TW;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Kregg T Brooks

Int. Cl.
CPC ...
C08L 53/00 (2006.01); C08F 293/00 (2006.01); C08F 299/02 (2006.01); C08K 5/3435 (2006.01); C08K 5/50 (2006.01); B32B 15/20 (2006.01); B32B 5/02 (2006.01); B32B 15/14 (2006.01); C08K 5/3415 (2006.01); C08J 5/24 (2006.01); C08L 71/12 (2006.01);
U.S. Cl.
CPC ...
C08L 53/00 (2013.01); B32B 5/02 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08F 293/00 (2013.01); C08F 299/022 (2013.01); C08F 299/024 (2013.01); C08J 5/244 (2021.05); C08J 5/246 (2021.05); C08K 5/3415 (2013.01); C08K 5/3435 (2013.01); C08K 5/50 (2013.01); C08L 71/12 (2013.01); B32B 2262/101 (2013.01); C08J 2353/00 (2013.01);
Abstract

A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.

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