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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11565502 B1

PDFFull Text
Date of Patent:
Jan. 31, 2023

Filed:

Nov. 29, 2019

Bonding method

Applicant:

Toyota Boshoku Kabushiki Kaisha, Aichi, JP;

Inventors:

Tatsuo Naito, Aichi, JP;

Masakazu Kito, Aichi, JP;

Assignee:

TOYOTA BOSHOKU KABUSHIKI KAISHA, Aichi, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Randy P Gulakowski

Assistant Examiner:

Ha S Nguyen

Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 7/027 (2019.01); B32B 27/08 (2006.01); C09J 179/02 (2006.01); C09J 5/00 (2006.01); C09J 5/04 (2006.01); C09J 5/06 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 7/027 (2019.01); B32B 27/08 (2013.01); C09J 179/02 (2013.01);
Abstract

Disclosed herein is a bonding method for bonding two adherends using an adhesive main agent that contains a thermoplastic resin having a cross-linkable group and a catalyst. The bonding method includes the steps of forming a main agent layer on one of the adherends; applying a catalyst onto the main agent layer; laminating the main agent layer and another adherend; and heating and pressing a laminated body in a layer thickness direction. Another embodiment of the bonding method may include a step of applying a catalyst onto one of the adherends, a step of forming a main agent layer on a surface onto which the catalyst has been applied, a step of laminating the two adherends, and a step of heating and pressing a laminated body in a layer thickness direction.

Find Patent Forward Citations

Naito, Tatsuo. (2023). Bonding method (U.S. Patent No. 11565502). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11565502

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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