The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
Jul. 01, 2019
Applicant:
Hamilton Sundstrand Corporation, Charlotte, NC (US);
Inventor:
Ricardo O. Brown, West Hartford, CT (US);
Assignee:
Hamilton Sundstrand Corporation, Charlotte, NC (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); B29C 65/08 (2006.01); B33Y 80/00 (2015.01); B29C 64/153 (2017.01); B29C 65/00 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B33Y 40/20 (2020.01); B29K 71/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/08 (2013.01); B29C 64/153 (2017.08); B29C 66/71 (2013.01); B29C 66/727 (2013.01); B29C 66/9513 (2013.01); B32B 27/08 (2013.01); B32B 27/285 (2013.01); B33Y 40/20 (2020.01); B33Y 80/00 (2014.12); B29K 2071/00 (2013.01); B32B 2262/106 (2013.01); B32B 2305/026 (2013.01);
Abstract
A method of forming a component includes additively manufacturing a first subcomponent, the first subcomponent including a first polymer material with a first porosity. The method further includes mating the first subcomponent with a second subcomponent and ultrasonically welding the first subcomponent to the second subcomponent at a weld frequency. The first porosity can be 5% or less.