The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Jul. 21, 2016
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Wei Huang, Palo Alto, CA (US);

Lihua Zhao, Palo Alto, CA (US);

Gary J. Dispoto, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B29C 70/88 (2006.01); B29C 64/336 (2017.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B29C 64/153 (2017.01); B29C 64/165 (2017.01); B29C 64/10 (2017.01); B29C 64/106 (2017.01); G01N 27/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B29C 64/153 (2017.08); B29C 64/336 (2017.08); B29C 70/882 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); B29C 64/10 (2017.08); B29C 64/106 (2017.08); B29C 64/165 (2017.08); G01N 27/002 (2013.01);
Abstract

A 3D object is additively formed via arranging non-conductive material relative to a receiving surface. During additive formation of the 3D object, a conductive channel is formed as part of the 3D object. In some instances, non-destructive fracture sensing is performed via measurement of an electrical parameter of the conductive channel.


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