The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2023

Filed:

Jan. 06, 2021
Applicant:

Huntington Ingalls Incorporated, Newport News, VA (US);

Inventors:

John W. Ralls, Yorktown, VA (US);

Zareh Soghomonian, Springfield, VA (US);

Daniel John Hebert, Carrollton, VA (US);

Kyle A. Wade, Poquoson, VA (US);

Assignee:

Huntington Ingalls Incorporated, Newport News, VA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 10/20 (2021.01); G06F 30/00 (2020.01); B22F 10/00 (2021.01); G01N 27/02 (2006.01); G05B 19/4099 (2006.01); G06F 30/20 (2020.01); B22F 10/30 (2021.01); B22F 10/10 (2021.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B22F 10/20 (2021.01); B22F 10/00 (2021.01); G01N 27/025 (2013.01); G06F 30/00 (2020.01); B22F 10/10 (2021.01); B22F 10/30 (2021.01); B22F 2202/07 (2013.01); B22F 2203/03 (2013.01); B22F 2999/00 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); G05B 19/4099 (2013.01); G06F 30/20 (2020.01); Y02P 10/25 (2015.11);
Abstract

An inspection system for in situ evaluation of an additive manufacturing (AM) build part is provided. The inspection system comprises a build plane induction coil sensor configured and positionable so that during construction of the build part, the sensor's magnetization and sensor coils surround at least the last-produced layer of the AM build part in the build plane. The inspection system further comprises an energization circuit and a central processing system. The central processing system comprises a communication processor configured for sending command signals to the energization circuit and receiving impedance data from the build plane induction coil sensor, and energization controller configured for determining energization commands for transmission to the energization circuit, and an induction data analyzer configured for processing build part impedance data using complex impedance plane analysis and for identifying anomalies in the AM build part.


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