The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2023
Filed:
May. 15, 2020
Applicant:
Hitachi, Ltd., Tokyo, JP;
Inventors:
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 10/20 (2021.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B22F 5/00 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B22F 10/20 (2021.01); B22F 5/00 (2013.01); B22F 2005/002 (2013.01); B22F 2202/11 (2013.01); B22F 2301/10 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12);
Abstract
Provided is a method of molding a composite material by laser metal deposition in which a powder metal material is irradiated with a laser beam while supplying the powder metal material onto a surface of a base material, in which the powder metal material is a mixed powder of an Fe alloy powder and a Cu powder, and a mixing ratio of the Fe alloy powder and the Cu powder is 15% or more and 30% or less by weight % of the Cu powder, and in which the composite material having anisotropy is molded by setting energy of the laser beam to be 9 KJ/g or more and 10 KJ/g or less in a mixed powder ratio.